IEEE DSC 2023 - IEEE International Conference on Data Science
in Cyberspace
The 8th IEEE International Conference on Data Science in
Cyberspace (IEEE DSC) will be held in Hefei, China, August 18-20, 2023. Over the past seven years, IEEE DSC
has become one of the most important and attractive international conference, mainly focusing on data
science and its application in cyberspace. The conference will feature world-class speakers, workshops,
demonstrations, exhibits, and innovative programs. Data Science, as a highly interdisciplinary field, is
playing a more and more critical and central role in the development of cyberspace and various applications.
Data science in cyberspace is an integral part of competitive intelligence, a newly emerging field that
encompasses a number of activities, such as data mining and data analysis. Data science in cyberspace
inspires novel techniques and theories drawn from many areas, such as mathematics, statistics, information
theory, computer science, and social science, and involves many specific domains, such as signal processing,
probability models, machine learning, statistical learning, data mining, database, data engineering, pattern
recognition and learning, visualization, predictive analytics, uncertainty modeling, data warehousing, data
compression, computer programming, and high performance computing.
IMPORTANT DATES
Full paper due: June 25, 2023
Acceptance notification: July 25, 2023
Camera-ready copy: August 2, 2023
Conference Date: August 18-20, 2023
Acceptance notification: July 25, 2023
Camera-ready copy: August 2, 2023
Conference Date: August 18-20, 2023
WHAT'S NEW
[2023-04-14] The online submission site is open (Read More)
ORGANIZATION
HONORARY
CO-CHAIRS
Binxing Fang, Chinese Academy of
Engineering, China
Philip S. Yu, University of Illinois at Chicago, USA
Shanlin Yang, Hefei University of Technology, China
Philip S. Yu, University of Illinois at Chicago, USA
Shanlin Yang, Hefei University of Technology, China
GENERAL CO-CHAIRS
Xiaofang Zhou, The Hong Kong University of Science and Technology, Hong Kong, China
Yezheng Liu, Hefei University of Technology, China
Yezheng Liu, Hefei University of Technology, China
PROGRAM CO-CHAIRS
Yuanchun Jiang, Hefei University of Technology, China
Yonggang Wen, Nanyang Technological University, Singapore
Richang Hong, Hefei University of Technology, China
Yonggang Wen, Nanyang Technological University, Singapore
Richang Hong, Hefei University of Technology, China
WORKSHOP CO-CHAIRS
Bin Zhou, National University of Defense Technology, China
Jianshan Sun, Hefei University of Technology, China
Taotao Cai, University of Southern Queensland, Australia
Jianshan Sun, Hefei University of Technology, China
Taotao Cai, University of Southern Queensland, Australia
Financial CO-Chair
Chunli Liu, Hefei University of Technology, China
Qian Dai, Hefei University of Technology, China
Qian Dai, Hefei University of Technology, China
Publication CO-Chair
Chao Fu, Hefei University of Technology, China
Jiajie Xu, Soochow University, China
Kun Yuan, Hefei University of Technology, China
Xu Zhang, University of Exeter
Jiajie Xu, Soochow University, China
Kun Yuan, Hefei University of Technology, China
Xu Zhang, University of Exeter
Publicity Co-Chairs
Zhaoquan Gu, Peng Cheng Laboratory, China
Yong Ding, Guilin University of Electronic Technology, China
Yidong Chai, Hefei University of Technology, China
Alexander G. Hauptmann, Carnegie Mellon University, USA
Yong Ding, Guilin University of Electronic Technology, China
Yidong Chai, Hefei University of Technology, China
Alexander G. Hauptmann, Carnegie Mellon University, USA
LOCAL CO-CHAIRS
Xiaoxuan Hu, Hefei University of Technology, China
Shanshan Niu, Hefei University of Technology, China
Xiaojun Wang, Hefei University of Technology, China
Shanshan Niu, Hefei University of Technology, China
Xiaojun Wang, Hefei University of Technology, China
Co-sponsored & Co-organized by
Participants please join the group.
